DEVICE FOR COATING A WAFER

摘要

11 Device for Coating a Wafer AbstractThe invention relates to a device for coating a surface (2o) of a wafer (2)With a retaining system (16) for placing the wafer (2) on a retaining surface (19), andA nozzle system (10) for coating the wafer (2) in a Z-direction, characterized in thaton a side periphery (2a) of the wafer (2), a ring (4) that surrounds the wafer (2) with an inside periphery (4i) can be arranged for expanding a coating surface when coating the wafer (2).Figure 1.