| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for forming a negative pattern capable of obtaining a wide focus depth for a fine trench patter or a hole pattern by using a resist composition capable of preventing lowered surface solubility in organic solvent development. <P>SOLUTION: There is provided a method for forming a negative pattern, in which a resist composition, which contains a polymer compound [A] containing a repeating unit (a1) having a structure in which a carboxyl group is protected by an acid labile group and a repeating unit (a2) containing one or more structures selected from an amino group, an amide bond, a carbamate bond and a nitrogen-containing heterocycle, a photoacid generating agent [B] and an organic solvent [C], is applied on a substrate and heat treated after being applied to form a resist film, the resist film is then exposed to a high energy beam and heat treated after exposure, and an unexposed part of the resist film is selectively dissolved with a developing solution containing an organic solvent. When a resist composition, which contains a polymer compound having a specific structure, a photoacid generating agent and an organic solvent, is combined with organic solvent negative development, a surface hardly-soluble layer is prevented from being formed and a wide focus depth for a fine trench pattern or a hole pattern can be obtained. <P>COPYRIGHT: (C)2013,JPO&INPIT |
