POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A power module package and a manufacturing method thereof are provided to reduce the size of a product by thinning a lead frame bonded to a control device than the lead frame bonded to a power device. CONSTITUTION: A first semiconductor chip(130) is bonded to one side(110a) of a first lead frame(110). A second semiconductor chip(140) is bonded to one side(120a) of a second lead frame(120). The thickness of the first lead frame is different from the thickness of the second lead frame. A molding material(160) surrounds one side of the first lead frame, one side of the second lead frame, the first semiconductor chip and the second semiconductor chip. The first semiconductor chip and the second semiconductor chip are electrically connected to each lead frame through a wire bonding using a wire(150).