| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor wafer inspection device capable of achieving high accuracy inspection while avoiding excessive increase in weight. <P>SOLUTION: The semiconductor wafer inspection device includes a surface plate 200 having a reference plane 210 directing vertically upward, a wafer support 300 movable along the reference plane 210 in the x direction and y direction with the weight of which being borne by the surface plate 200 at least partially, and supporting a semiconductor wafer having a functional surface, on which an integrated circuit is formed, at a position where the functional surface is directed vertically upward, moving means 400 for moving the wafer support 300 in the x direction and y direction, and an inspection head for inspecting the functional surface of the semiconductor wafer. <P>COPYRIGHT: (C)2013,JPO&INPIT |
