| 摘要 |
A circuit arrangement includes at least one electronic and/or electrical component and a carrier. The at least one electronic and/or electrical component is conductively connected to the carrier by at least one solder layer while forming an air space between the electronic and/or electrical component and the carrier. At least one three-dimensional mounting structure is integrated in the carrier and the at least one electronic and/or electrical component is arranged axially between at least two contact regions of the mounting structure. |
