PRETREATMENT SOLUTION FOR ELECTROLESS COPPER PLATING, AND ELECTROLESS COPPER PLATING METHOD

摘要

Copper nanoparticles having an average particle diameter of 1 to 250 nm are dispersed in a solvent using a dispersant, the copper nanoparticle and dispersant concentrations are optimized to within predetermined ranges, a nonconductive substrate is immersed in the resulting pretreatment solution for electroless copper plating and thereby brought into contact with the copper catalyst, and then electroless copper plating of the nonconductive substrate is performed. The dispersion is prepared using very fine copper nanoparticles having a particle diameter of 250 nm or less and therefore, when electroless copper plating is performed after immersing the nonconductive substrate, a uniform copper film can be formed on the substrate surface.