| 摘要 |
<P>PROBLEM TO BE SOLVED: To easily cut a chamfered part of a wafer without causing damage to a surface of a support substrate supporting the wafer. <P>SOLUTION: In a support substrate 1 to which a circular wafer W is attached through a bond agent, a ring shaped clearance groove 2 is formed on a surface 1a. Thus, when a surface Wa of the wafer W is attached to the surface 1a of the support substrate 1 and a chamfered part 4 formed at an outer periphery of the wafer W is removed, a cutting blade 60 enters into the clearance groove 2 and thus the cutting blade 60 avoids contacting with the support substrate 1. This structure allows the cutting blade 60 to easily cut the chamfered part 4 of the wafer W without causing damage to the surface 1a of the support substrate 1. <P>COPYRIGHT: (C)2013,JPO&INPIT |
