发明名称 Hot-Wire Sensor of Submillimeter Size and Associated Method of Production
摘要 The invention relates to a submillimeter-sized hot-wire sensor (1) comprising a substrate (10), two support rods (11, 12), a metal wire (13) extending between the two ends of the support rods (11, 12), and electrical contacts (14, 15) disposed on the support rods, said contacts each being linked to one of the ends of the wire (13). The metal wire comprises at least two layers of metal materials, one of said layers being made of a material exhibiting a residual stress under tension and the other layer being made of a material exhibiting a residual stress under compression. The thicknesses of these metal layers are adapted so as to compensate the residual stresses between the various layers.
申请公布号 US2013125644(A1) 申请公布日期 2013.05.23
申请号 US201113640621 申请日期 2011.04.11
申请人 PERNOD PHILIPPE JACQUES;GIMENO MONGE LETICIA;TALBI ABDELKRIM;MERLEN ALAIN;VIARD ROMAIN VICTOR JEAN;MORTET VINCENT;SOLTANI ALI;PREOBRAZHENSKY VLADIMIR;ECOLE CENTRALE DE LILLE;CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE 发明人 PERNOD PHILIPPE JACQUES;GIMENO MONGE LETICIA;TALBI ABDELKRIM;MERLEN ALAIN;VIARD ROMAIN VICTOR JEAN;MORTET VINCENT;SOLTANI ALI;PREOBRAZHENSKY VLADIMIR
分类号 G01F1/69 主分类号 G01F1/69
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