| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an expansion device and an expansion processing method of a semiconductor substrate, capable of securely performing substrate cleavage and metal film segmentation and capable of chip separation in a short time. <P>SOLUTION: On the top face side of a tape extension stage 11, there are disposed an extension holding ring 9 and a plurality of annular ring members R1-Rn, having mutually different diameters, formed inside the extension holding ring 9. The ring members R1-Rn are divided into concentric cylinder shapes to configure a pressing spherical surface 11a. A ring member positioned on an outermost ring is defined to be a ring member R1, and ring members R2, ... Rn-1 are disposed successively on the inner side. The n-th ring member positioned at the central portion is defined to be Rn. The curvature of the pressing spherical surface 11a is adjusted by independently determining the vertical positions of the ring members R1-Rn. <P>COPYRIGHT: (C)2013,JPO&INPIT |
