发明名称 LASER BEAM PROCESSING APPARATUS AND LASER BEAM PROCESSING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To improve cutting quality when processing a workpiece by applying a laser beam. <P>SOLUTION: A first pulse laser beam and a second pulse laser beam, having the same constant repetitive frequency, are superimposed and the superimposed first and second pulse laser beams are irradiated to the workpiece. The pulse string P1 of the first pulse laser beam and the pulse string P2 of the second pulse laser beam are synchronized so that the pulse string P1 of the first pulse laser beam and the pulse string P2 of the second pulse laser beam obtain a deviation time Td that is a constant relation of time. As a state of synchronization of two pulse laser beams, there are a case where a deviation time Td is Td=0 and a case where a deviation time Td is Td&ne;0. Therefore, depending upon the workpiece, deviation time Td=0 is selected, or deviation time Td&ne;0 is selected as a most suitable time to the workpiece, and then the workpiece is processed. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013094845(A) 申请公布日期 2013.05.20
申请号 JP20110242380 申请日期 2011.11.04
申请人 TOWA CORP;OKAYAMA UNIV 发明人 UNO YOSHIYUKI;OKAMOTO YASUHIRO;YAMAMOTO KYO;KITADA RYOJI
分类号 B23K26/00;B23K26/06;B23K26/38;B23K26/40;H01S3/00;H01S3/23;H05K3/00 主分类号 B23K26/00
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