| 发明名称 |
MULTI-CHIP MODULE FOR DOWN-HOLE DEVICE |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic assembly which is used in a down-hole module and achieves good connection reliability. <P>SOLUTION: An electronic assembly 200 has: a multilayer ceramic assembly; and an electronic component 240 disposed on the multilayer ceramic assembly. The multilayer ceramic assembly includes: a ceramic substrate 220; a nickel plating layer disposed on the ceramic substrate 220; and a gold plating layer disposed on the nickel plating layer and having a thickness of 0.5 micron or smaller. The electronic component 240 is wire-bonded to the gold plating layer by an aluminum wire. <P>COPYRIGHT: (C)2013,JPO&INPIT |
| 申请公布号 |
JP2013098574(A) |
申请公布日期 |
2013.05.20 |
| 申请号 |
JP20120242345 |
申请日期 |
2012.11.02 |
| 申请人 |
SCHLUMBERGER HOLDINGS LTD |
发明人 |
FRANCOIS BERBALA;LARCEN GALLAND |
| 分类号 |
H01L21/60;C04B41/88;H01L23/13;H05K1/18 |
主分类号 |
H01L21/60 |
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