发明名称 |
SUBSTRATE PROCESSING SYSTEM, SUBSTRATE TRANSFER METHOD, PROGRAM, AND COMPUTER STORAGE MEDIUM |
摘要 |
<P>PROBLEM TO BE SOLVED: To improve the yield of substrate processing in a substrate processing system which includes a function for cleaning a rear surface of a substrate before exposure. <P>SOLUTION: An interface station 5 of an application and development processing system includes: a cleaning unit 100 which cleans at least a rear surface of a wafer before the wafer is carried into an exposure device; an inspection unit 101 inspecting the rear surface of the wafer after the cleaning to determine whether or not exposure can be performed thereon before the wafer is carried into the exposure device; and wafer transfer mechanisms 120, 130 including arms transferring the substrate between the respective units 100, 101; and a wafer transfer control part controlling the operations of the wafer transfer mechanisms 120, 130. The wafer transfer control part controls the wafer transfer mechanisms 120, 130 so as to re-transfer the wafer to the cleaning unit 100 when the inspection determines that exposure can be performed on the wafer after the wafer is re-cleaned in the cleaning unit 100. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2013098477(A) |
申请公布日期 |
2013.05.20 |
申请号 |
JP20110242333 |
申请日期 |
2011.11.04 |
申请人 |
TOKYO ELECTRON LTD |
发明人 |
NAKAHARADA MASAHIRO;SAKATA YOJI;MIYATA AKIRA;HAYASHI SHINICHI;ENOKIDA SUGURU;NAKAJIMA TSUNENAGA |
分类号 |
H01L21/027;B65G49/07;G03F7/20;H01L21/677 |
主分类号 |
H01L21/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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