CURING AGENT, MICROCAPSULE-TYPE CURING AGENT, MASTER BATCH-TYPE CURING AGENT COMPOSITION, ONE-PACK EPOXY RESIN COMPOSITION AND PROCESSED GOODS

摘要

PROBLEM TO BE SOLVED: To provide a curing agent excellent in low temperature curability, solvent resistance and storage stability.

SOLUTION: This curing agent includes a compound represented by general formula (1) and/or a compound represented by the formula (1) substituted with an alkoxy group having a specific imidazole structure at the ortho site (in formula, R1-R3each independently represents a hydrogen atom, a 1-18C alkyl group which may be substituted or a 1-18C aryl group which may be substituted, at least one of R4-R7represents a 1-8C alkyl group which may be substituted or a 1-8C aryl group which may be substituted and n is an integer of 0-10).

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