| 摘要 |
<P>PROBLEM TO BE SOLVED: To make a printed circuit board thin and to implement high-density mounting. <P>SOLUTION: While holding an adhesive agent 16 between a first core substrate 11 in which first wiring 20A covered with a protecting layer is formed and a second core substrate 13 in which second wiring 20B is formed, the adhesive agent 16 is cured. Thus, the first core substrate 11 and the second core substrate 13 are bonded and integrated to configure a printed circuit board 17. Next, a stepped portion 22 is formed from an outer surface of the second core substrate 13 to a surface of the protecting layer. Then, a protecting layer 14 residual on the bottom of the stepped portion 22 is released from the integrated first and second core substrates 11 and 13 and at least a part of the first wiring 20A is exposed, thereby forming a terminal. <P>COPYRIGHT: (C)2013,JPO&INPIT |
