发明名称 CREDENTIAL MANUFACTURING DEVICE SUBSTRATE SHUTTLE
摘要 One embodiment of a credential manufacturing device comprises a first hopper, a first processing path, a first processing device, a substrate shuttle and a shuttle drive. The first hopper is configured to contain a plurality of card substrates and includes an output port. The first processing device is in the first processing path and is configured to perform a first process on individual card substrates in the first processing path. The substrate shuttle is positioned between the first hopper and the first processing path and is configured to receive individual card substrates from the output port of the first hopper, transport received card substrates along a shuttle path, and deliver received card substrates to the first processing path. The shuttle drive is configured to drive movement of the substrate shuttle along the shuttle path.
申请公布号 US2013121793(A1) 申请公布日期 2013.05.16
申请号 US201113293595 申请日期 2011.11.10
申请人 HOFFMAN TED M.;UMBERGER PHILIP G.;HID GLOBAL CORPORATION 发明人 HOFFMAN TED M.;UMBERGER PHILIP G.
分类号 B65G49/00 主分类号 B65G49/00
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