| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a wiring board which meets a demand for improving electric reliability, and to provide a manufacturing method of a packaging structure which uses the manufacturing method of the wiring board. <P>SOLUTION: A wiring board 4 according to one embodiment of this invention comprises the steps of: preparing a substrate 7 having a fiber layer 14 containing a first resin 10 and glass fibers 12 coated by the first resin 10; jetting fine particles to the substrate 7 at a jet amount ranging 30 g/min to 150 g/min using sand blasting technique, thereby forming through holes T on the substrate 7; and forming a through hole conductor 8 in each through hole T. <P>COPYRIGHT: (C)2013,JPO&INPIT |
