| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an optical module on which an integrated circuit is flip-chip mounted that reduces crosstalk between adjacent channels and achieves excellent signal transmission even in performing ultra high-speed transmission of 25 Gbps or more. <P>SOLUTION: Of adjacent first and second electrode pads on a multilayer substrate, the first electrode pad is sequentially connected to a first conductor via and first inner-layer conductor wiring, and the second electrode pad is connected to surface-layer conductor wiring of the multilayer substrate, a third electrode pad, a second conductor via, and second inner-layer conductor wiring. A ground conductor via or a power-supply conductor via is provided between the first inner-layer conductor wiring and the surface-layer conductor wiring, and a ground conductor wiring layer or a power-supply conductor wiring layer is provided between a first formation layer in which the first inner-layer conductor wiring is formed and a second formation layer in which the second inner-layer conductor wiring is formed. The first and second electrode pads are connected to electrode pads formed on surfaces of first and second optical elements, respectively. <P>COPYRIGHT: (C)2013,JPO&INPIT |
