REMELTING METHOD AND SUBSEQUENT REFILLING AND COMPONENT

摘要

The invention relates to a method for remelting and refilling a defect (7) in a surface (19) of a substrate (4), wherein the defect (7) is remelted and wherein a hollow (28) is produced and wherein the hollow (28) that has been produced is refilled, and also to a component having a remelted region (25) and a solder region (31) thereover. In particular, a nickel- or cobalt-based substrate (4) is remelted by a laser remelting method, and subsequently the hollow (28) that is produced is refilled by a laser application method, in particular by soldering.