| 摘要 |
A clearance filling PCB includes pin contact units on a surface of the external layer of the PCB and clearance filling units formed by molding a clearance between the pin contact units and polishing an insulating layer so that the height of the insulating layer becomes equal to the height of the pin contact units in order to prevent the sliding of a fine pitch circuit with a pin and induce accurate contact between the fine pitch circuit and the pin, and a method of manufacturing the same. The height of the insulating layer is made equal to the height of the pin contact units by molding the clearance between the pin contact units on the surface of the external layer of the PCB, and the sliding of a fine pitch circuit, requiring contacts, with a pin can be prevented. |
