发明名称 |
WIRING SUBSTRATE, METHOD FOR MANUFACTURING WIRING SUBSTRATE, AND VIA PASTE |
摘要 |
<p>Disclosed is a multilayer wiring board having via-hole conductors, the via-hole conductor including a metal portion and a resin portion. The metal portion includes a first metal region which includes a link of copper particles forming a path electrically connecting a first wiring and a second wiring; a second metal region mainly composed of a metal selected from the group consisting of tin, a tin-copper alloy, and a tin-copper intermetallic compound; a third metal region mainly composed of bismuth; and a fourth metal region composed of tin-bismuth solder particles. The link has plane-to-plane contact portions where the copper particles are in plane-to-plane contact with one another. At least a part of the second metal region is in contact with the first metal region. The tin-bismuth solder particles, each surrounded by the resin portion, are interspersed in the via-hole conductor.</p> |
申请公布号 |
EP2563103(A4) |
申请公布日期 |
2013.05.15 |
申请号 |
EP20110856268 |
申请日期 |
2011.12.19 |
申请人 |
PANASONIC CORPORATION;KYOTO ELEX CO., LTD. |
发明人 |
HIRAI, SHOGO;HIMORI, TSUYOSHI;ISHITOMI, HIROYUKI;HIGUCHI, TAKAYUKI;TOMEKAWA, SATORU;NAKAYAMA, YUTAKA |
分类号 |
H05K1/11;H01B5/00;H05K1/09;H05K3/40;H05K3/46 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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