发明名称 |
Composite, prepreg, laminated plate clad with metal foil, material for connecting circuit board, and multilayer printed wiring board and method for manufacture thereof |
摘要 |
It is an object of the invention to provide a composite with sufficiently reliable bonding and adequately minimized generation of fluff from flaking resin dust and fibers. This object is achieved by the composite (100) of the invention that comprises a fiber sheet (101) impregnated with a resin composition (102), wherein the 20° C. storage elastic modulus of the cured resin composition (102) is 100-2000 MPa. The composite (100) optionally contains perforations (103). |
申请公布号 |
US8440285(B2) |
申请公布日期 |
2013.05.14 |
申请号 |
US20060912934 |
申请日期 |
2006.04.21 |
申请人 |
TAKANO NOZOMU;KAMIYA MASAKI;HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
TAKANO NOZOMU;KAMIYA MASAKI |
分类号 |
B32B3/24;B32B5/24;B32B17/02;B32B27/04;B32B37/02;C08L33/02 |
主分类号 |
B32B3/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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