Universal conduction cooling platform

摘要

Disclosed is an embodiment of a module for insertion between a first shelf and a second shelf of a rack based processing system. The module includes a first thermal plate substantially parallel to a second thermal plate. An inner surface of the first thermal plate faces an inner surface of the second plate and an outer surface of each of the first and second thermal plates faces opposite to the respective inner surfaces. Each thermal plate is configured to thermally couple to one or more component units locatable between the inner surfaces of the first and second thermal plates.