| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a slice stand, in which the amount of impurities mixed into a sludge produced by a fixed abrasive grain system is extremely small, with a lower cost without impairing the cutting properties, and to provide a manufacturing method of a semiconductor wafer using the slice stand. <P>SOLUTION: A slice stand 1 which fixes a semiconductor block 2 when it is cut is provided, at least on the fixing side of the semiconductor block 2, with a member obtained by cutting out a disposal part of a semiconductor ingot composed of the same kind of semiconductor material as that of the semiconductor block 2. <P>COPYRIGHT: (C)2013,JPO&INPIT |
