| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which causes no excess space on an outer side of a mold package when a semiconductor device and an external circuit are connected, and which enables the connection without using a solder. <P>SOLUTION: A semiconductor device 100 comprises: semiconductor elements 1, 2 and electrode terminal parts 3, 4, 6 which are covered with a mold package part 9; first opening holes 10, 11 formed in a first principal surface of the mold package part 9, in which the electrode terminal parts 3, 4, 6 are exposed on bottom faces; external connection members 17A, 17B, 17C fixed to the first principal surface so as to block openings of the first opening holes 10, 11; and first contact members 16A, 16B, 19 arranged inside the first opening holes 10, 11 and having elasticity, for electrically connecting the electrode terminal parts 3, 4, 6 and the external connection members 17A, 17B, 17C. <P>COPYRIGHT: (C)2013,JPO&INPIT |
