发明名称 METHOD FOR MANUFACTURING WIRING BOARD, METHOD FOR MANUFACTURING TOUCH PANEL TYPE DISPLAY DEVICE, EXPOSURE DEVICE, WIRING BOARD, TOUCH PANEL, AND TOUCH PANEL TYPE DISPLAY DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring board by which wiring patterns can be formed as different from each other between on a top face and on a back face of a substrate, a method for manufacturing a touch panel type display device, an exposure device, a wiring board, a touch panel, and a touch panel type display device. <P>SOLUTION: Transparent conductive thin films 31a, 31b and photosensitive resist films 32a, 32b are successively formed on a top face and a back face of a substrate 12 having linear polarizing property, respectively. Masks 37a, 37b are disposed on the photosensitive resist films 32a, 32b, respectively and the masks 37a, 37b are irradiated with exposure light polarized in a direction that is not transmitted through the substrate 12. After the photosensitive resist films 32a, 32b are irradiated with the exposure light transmitted through the masks 37a, 37b, respectively, the photosensitive resist films are developed; and the conductive thin films 31a, 31b appearing among the developed photosensitive resist films 32a', 32b' are removed to form first and second wiring lines 14a, 14b, respectively. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013089150(A) 申请公布日期 2013.05.13
申请号 JP20110231325 申请日期 2011.10.21
申请人 ULVAC JAPAN LTD 发明人 NAKAO HIROTOSHI;SATO SEIICHI
分类号 G06F3/041;G02B5/30;G02F1/1333;G09F9/00 主分类号 G06F3/041
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