| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a high strength and high conductive copper alloy which has high strength and conductivity concurrently and further has superior uniform etching property at the time of half etching, and to provide a method of manufacturing the copper alloy. <P>SOLUTION: The high strength and high conductive copper alloy contains 0.05-1.0 mass% of Fe, 0.05-1.0 mass% of Ni, 0.02-0.3 mass% of P, and the remainder being Cu and inevitable impurities, wherein: a mass ratio (Fe+Ni)/P of sum of Fe and Ni to P is 3-10; and mass ratio Ni/Fe of Ni to Fe is 1-10. Among crystallized products and precipitated products having a grain size of 10 nm or more in the copper alloy, the proportion of the crystallized products and the precipitated products having a grain size of 100 nm or more is 1% or less. The method of manufacturing the copper alloy is also provided. <P>COPYRIGHT: (C)2013,JPO&INPIT |
