APPARATUS FOR MANUFACTURING ELECTRONIC PART, METHOD OF MANUFACTURING ELECTRONIC PART, AND METHOD OF MANUFACTURING LED ILLUMINATION

摘要

Provided are an apparatus for manufacturing an electronic part and a method of manufacturing the electronic part, wherein an electronic element can be soldered to a printed circuit board in a shorter time than conventional methods, and wherein damage to the electronic element, spattering of solder, and damage to the circuit board can be inhibited. An apparatus (100) for manufacturing an electronic part (112) according to the present invention, which mounts an electronic element (108) on a printed circuit board (122) comprising a substrate (122A) and a wiring pattern (122B) disposed thereon, comprises: a supplying apparatus (102) that supplies solder (104) onto the wiring pattern (122B) of the printed circuit board (122); a placing apparatus (106) that places the electronic element (108) on the solder (104); a laser (112) that radiates light having the center wavelength of the light-emission thereof within a range of 700 nm - 1100 nm, towards the solder (104) upon which the electronic element (108) is mounted, from the back face (124) side of the printed circuit board. The apparatus (100) for manufacturing an electronic part (112) is characterized in that the light transmits through the substrate (122A) to reach the wiring pattern (122B), heats the wiring pattern (122B) and melts the solder (104), so that the electronic element (108) is soldered to the printed circuit board (122).