发明名称 |
METHOD OF IMPROVING THIN-FILM ENCAPSULATION FOR AN ELECTROMECHANICAL SYSTEMS ASSEMBLY |
摘要 |
<p>This disclosure provides systems, methods, and apparatus for fabricating electromechanical systems devices. In one aspect, a method of sealing an electromechanical systems device includes etching a sacrificial layer. The sacrificial layer is formed between a surface of a substrate and a shell layer and is etched through etch holes in the shell layer formed over the electromechanical systems device. The etch holes in the shell layer have a diameter greater than about one micron. The shell layer is then treated. A seal layer is deposited on the treated shell layer. The seal layer hermetically seals the electromechanical systems device.</p> |
申请公布号 |
WO2013066773(A1) |
申请公布日期 |
2013.05.10 |
申请号 |
WO2012US62287 |
申请日期 |
2012.10.26 |
申请人 |
QUALCOMM MEMS TECHNOLOGIES, INC. |
发明人 |
HE, RIHUI;LONDERGAN, ANA RANGELOVA;GOUSEV, EVGENI PETROVICH |
分类号 |
B81C1/00 |
主分类号 |
B81C1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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