INSULATING RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD COMPRISING THE SAME

摘要

PURPOSE: An insulating resin composition is provided to obtain electrical, thermal, and mechanical stability for a printed circuit board even when the weight, thickness, and size of the printed circuit board are minimized. CONSTITUTION: An insulating resin composition comprises 40-70 weight% of a structure unit represented by chemical formula 1 and a structure unit represented by chemical formula 2. At least one terminal comprises a liquid crystal oligomer which includes a functional group represented by chemical formula E; 10-30 weight% of an epoxy resin; 10-30 weight% of a cyanate-based resin; and 0.1-0.5 weight% of a curing catalyst. A printed circuit board comprises an insulating layer which includes the insulating resin composition; and a circuit pattern formed on the insulating layer.