发明名称
摘要 <p>Provided are a laser working method and a laser working apparatus using a cooling method by a solid contact, which are freed from the problem of producing metal powder, the problem of sticking blots of a cooling member to a substrate, and the development of flaws by frictions. The laser working apparatus comprises a laser irradiation mechanism for forming a beam spot on a fragile material substrate, a substrate cooling mechanism for forming a cooling region, and a scanning mechanism for moving the beam spot and the cooling region relatively in the order of the beam spot and the cooling region along a scheduled working line set on the substrate. The substrate cooling mechanism includes a solid-phase coolant solidified by cooling a coolant material taking a gas or liquid phase at the ordinary temperature, and a push mechanism for causing the solid-phase coolant to contact the substrate.</p>
申请公布号 JP5193294(B2) 申请公布日期 2013.05.08
申请号 JP20100514411 申请日期 2009.04.07
申请人 发明人
分类号 B23K26/00;B23K26/42;C03B33/09 主分类号 B23K26/00
代理机构 代理人
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