SUBSTRATE INSPECTING APPARATUS

摘要

The present invention relates to a substrate inspecting apparatus, which is configured as an apparatus capable of simultaneously inspecting whether the quality of the edge portion of a substrate in the vertical axis direction (lengthwise direction) and the horizontal axis direction (widthwise direction) is normal, that is, whether cracks or chipping have occurred at a point when the substrate is fed into an ultrasonic cleaner (USC) and at a point when impurities are removed from the surface of the substrate by the USC. Thus, the quality of a substrate is checked before the substrate is fed into a processing chamber in order to prevent damage to the substrate during processing, and also to allow separate inspections to be performed in two stages for the horizontal axis and the vertical axis in order to solve the drawback of an inspection failing to be performed on the portion of the horizontal axis which is covered by a robot fork in the state in which images are obtained of four surfaces of the substrate during entry into a first cleaner.