| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a copper foil for a printed wiring board capable of manufacturing a circuit having a cross section shape which is suitable for finer pitches and whose skirt is small with excellent manufacturing efficiency and to provide a laminate sheet using the same. <P>SOLUTION: A copper foil for a printed wiring board includes: a copper foil base material; and a coating layer which covers at least a part of the surface of the copper foil base material and includes one kind or more selected from the group consisting of Au, Pt, Pd and Mo. In the coating layer, the amount of deposited A is 650 μg/dm<SP POS="POST">2</SP>or less, the amount of deposited Pt is 650 μg/dm<SP POS="POST">2</SP>or less, the amount of deposited Pd is 400 μg/dm<SP POS="POST">2</SP>or less and the amount of deposited Mo is 1000 μg/dm<SP POS="POST">2</SP>or less. When a circuit having a prescribed width and a prescribed pitch is formed, and a cupric chloride solution whose cupric chloride concentration is 2.0M and hydrochloric acid concentration is 0-4.5M or a ferric chloride solution whose cupric chloride concentration is 3.2M and hydrochloric acid concentration is 0-1.0M is injected at 50°C with a pressure of 0.2 MPa to perform etching, time until the bottom width becomes a half of the circuit pitch is shorter than a case where the coating layer is not formed by 1 second or more. <P>COPYRIGHT: (C)2013,JPO&INPIT |
