发明名称 Sputtering apparatus
摘要 A sputtering apparatus includes a preheating chamber, a deposition chamber, a passage in communication with the preheating chamber and the deposition chamber, a first support assembly received in the preheating chamber, a second support assembly received in the deposition chamber, a number of posts capable of mounting on each of the first and second support assemblies, a transferring robot arranged in the preheating chamber, and a magnetic assembly fixed on the transferring robot. The transferring robot is configured for demounting the post from the two support assemblies, transferring the demounted post between the preheating chamber and the deposition chamber, and mounting the transferred post on the two support assemblies. The magnetic assembly is configured for collecting iron workpieces dropped on a bottom in the preheating chamber, the deposition chamber, or the passage.
申请公布号 US8430998(B2) 申请公布日期 2013.04.30
申请号 US20100891817 申请日期 2010.09.28
申请人 WANG CHUNG-PEI;HON HAI PRECISION INDUSTRY CO., LTD. 发明人 WANG CHUNG-PEI
分类号 C23C14/00;C25B11/00;C25B13/00 主分类号 C23C14/00
代理机构 代理人
主权项
地址
您可能感兴趣的专利