发明名称 POLISHING APPARATUS AND POLISHING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a polishing apparatus which achieves stable polishing performance by keeping the tension of a polishing tape almost constant during polishing, and has an increased polishing speed. <P>SOLUTION: The polishing apparatus includes a polishing head 42 configured to bring a polishing tape 41 into contact with a workpiece and a swinging mechanism configured to cause the polishing head 42 to perform a swinging motion with its pivot laid on a predetermined point. The swinging mechanism includes a swing arm 60 to which the polishing head 42 is fixed, a support arm 62, a connection shaft 67 for rotatably connecting the swing arm 60 to the support arm 62, and a drive mechanism M1 causing the swing arm 60 to perform a swinging motion with its pivot laid on the connection shaft 67. The center point of the swinging motion of the polishing head 42 is on the center line of the connection shaft 67. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013075358(A) 申请公布日期 2013.04.25
申请号 JP20120273699 申请日期 2012.12.14
申请人 EBARA CORP 发明人 TAKAHASHI YOSHIMIZU;SEKI MASAYA;KUSA HIROAKI;ITO KENYA
分类号 B24B21/00;B24B9/00;H01L21/304 主分类号 B24B21/00
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