| 摘要 |
<P>PROBLEM TO BE SOLVED: To connect a first connection terminal and a second connection terminal which are arranged at high density with good electric connection reliability. <P>SOLUTION: In order to manufacture an inkjet head, a recess 51b is formed at a portion opposed to a land 52 on an upper surface of a flexible layer 51 first, then a reversible thermal contraction layer 56 is formed to cover the recess 51b. Next, a solder resist layer 55 is formed on a lower surface of the flexible layer 51, and a solder 46 is formed on a surface of the land 52 exposed from a through-hole 55a of the solder resist layer 55. After the connection terminal 45a is rinsed, a COF (Chip On Film) 50 is heated while it is pressed toward a piezoelectric layer 42, so that the portion opposed to the land 52 of the flexible layer 51 is caused to swell to the piezoelectric layer 42 side and also the solder 46 is brought into contact with the connection terminal 45a. By separating a heater H thereafter, the flexible layer is restored to a state before it swells, and the solder 46 is stretched upward to have a concaved surface. <P>COPYRIGHT: (C)2010,JPO&INPIT |
