发明名称 |
Laminated interconnects for organic opto-electronic device modules and method |
摘要 |
A method of producing an encapsulated module of interconnected opto-electronic devices which comprises: forming a patterned anode layer; forming a layer of opto-electronically active material over the patterned anode layer; forming a patterned cathode layer over the layer of opto-electronically active material, to provide a device array of opto-electronically active cells on the substrate; selectively removing portions of the layer of opto-electronically active material so as to expose minor portions of the anodes; forming a patterned interconnect layer on an encapsulating sheet in a pattern to define an array of interconnect pads; and laminating the patterned encapsulating sheet over the array of opto-electronically active cells whereby the exposed anode portions are interconnected with the cathodes of adjacent cells by the interconnect pads and the interconnected cells are encapsulated by the encapsulating sheet.
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申请公布号 |
US8425272(B2) |
申请公布日期 |
2013.04.23 |
申请号 |
US20050658710 |
申请日期 |
2005.07.25 |
申请人 |
HALLS JONATHAN J.;WILSON RICHARD;CAMBRIDGE DISPLAY TECHNOLOGY LIMITED |
发明人 |
HALLS JONATHAN J.;WILSON RICHARD |
分类号 |
H01L51/56;H01L25/04;H01L51/00;H01L51/42;H01L51/52 |
主分类号 |
H01L51/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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