| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a taping apparatus and a taping method with high productivity by which wafers are not left behind and all the wafers in a magazine can be treated without fail. <P>SOLUTION: The wafer is mounted in each stage of the magazine and the presence or absence of the wafer in each stage is sensed. The wafer is taken out from the magazine on the basis of a sensing result of the presence or absence of the wafer and then mounted at a specified position. A plurality of dies owned by the mounted wafer are sequentially picked up. The picked-up dies are sequentially set in each housing which has a recess shape on a carrier tape. After treating the wafer as shown above, the wafer is returned to the magazine. Then, the presence of wafers which cannot be taken out from the magazine is detected and the presence or absence of the wafers is notified to an operator. <P>COPYRIGHT: (C)2013,JPO&INPIT |
