THE METHOD FOR MANUFACTURING THE RADIANT HEAT CIRCUIT BOARD UNIFIED BLANKET AND THE PATTERNED MASK FOR MANUFACTURING THE SAME

摘要

PURPOSE: A manufacturing method of blanket integrated type heat radiation circuit board and a pattern mask used for the same are provided to improve heat radiating property by directly delivering heat to a chassis through directly connecting a heat radiating circuit board to the lateral surface of the chassis. CONSTITUTION: A heat radiation circuit board in which a first side and a second side are formed is prepared. The first and second sides of the heat radiation circuit board are curved. A mask(200) exposing a pad on the first side of the heat radiation circuit board is formed. The pattern mask comprises a pad hole(210) exposing the pad and a substrate hole(220) exposing a bending region(130a). A solder(151) is coated on the pad. A light emitting device is adhered to the solder.