发明名称 SILICON CARBIDE SUBSTRATE, SILICON CARBIDE SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SILICON CARBIDE SUBSTRATE, AND METHOD FOR MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE
摘要 <p>Single crystal substrates (1-9) are composed of a silicon carbide, and respectively have first front surfaces (1a, 2a, 3a) and first rear surfaces (1b, 2b, 3b), said first front surfaces and first rear surfaces facing each other. A supporting substrate (10) has a second front surface (10a) and a second rear surface (10b) that face each other. A connecting layer (11) has a silicon carbide as a main component, is provided between the single crystal substrates (1-9) and the supporting substrate (10), and connects respective first rear surfaces (1b, 2b, 3b) with the second front surface (10a) such that respective first rear surfaces (1b, 2b, 3b) face the second front surface (10a).</p>
申请公布号 WO2013054580(A1) 申请公布日期 2013.04.18
申请号 WO2012JP69315 申请日期 2012.07.30
申请人 SUMITOMO ELECTRIC INDUSTRIES, LTD.;ISHIBASHI, KEIJI;HORI, TSUTOMU;UETA, SHUNSAKU;SAITOH, YU;UCHIDA, KOSUKE 发明人 ISHIBASHI, KEIJI;HORI, TSUTOMU;UETA, SHUNSAKU;SAITOH, YU;UCHIDA, KOSUKE
分类号 H01L21/02;C30B29/36;H01L21/20;H01L21/265;H01L21/336;H01L29/12;H01L29/78 主分类号 H01L21/02
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