| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve such problems that it is required to lead out both ends of a coil to the bottom face of a laminate through vias when terminals are formed only on the bottom face of a laminate, and that when terminals are formed over the bottom face and the side surface of a laminate, the terminal becomes thin at a corner where the bottom face and the side surface of a laminate intersect, and is divided into a portion formed on the bottom face of a laminate and a portion formed on the side surface of a laminate thus causing disconnection or increase in DC resistance. <P>SOLUTION: An insulator layer and a conductor pattern are laminated, and a circuit element is formed in the laminate. At a corner of the laminate where the bottom face and the side surface intersect, a conductor is formed to expose the surface to the corner. An electrode for connection with the conductor is formed on the side surface of the laminate. Both ends of the circuit element are connected with the electrode on the side surface of the laminate, and a terminal is formed by the conductor and the electrode. <P>COPYRIGHT: (C)2013,JPO&INPIT |
