发明名称 Integrated circuit heat spreader stacking system
摘要 An integrated circuit heat spreader stacking system includes: an integrated circuit on a substrate; a heat spreader having a heat sink dome; a stacking stand-off for the heat spreader; and the heat spreader mounted with the heat sink dome over the integrated circuit.
申请公布号 US8421221(B2) 申请公布日期 2013.04.16
申请号 US20100781772 申请日期 2010.05.17
申请人 FILOTEO, JR. DARIO S.;ESPIRITU EMMANUEL;CABLAO PHILIP LYNDON;STATS CHIPPAC LTD. 发明人 FILOTEO, JR. DARIO S.;ESPIRITU EMMANUEL;CABLAO PHILIP LYNDON
分类号 H01L23/34;H01L23/28 主分类号 H01L23/34
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