An integrated circuit heat spreader stacking system includes: an integrated circuit on a substrate; a heat spreader having a heat sink dome; a stacking stand-off for the heat spreader; and the heat spreader mounted with the heat sink dome over the integrated circuit.
申请公布号
US8421221(B2)
申请公布日期
2013.04.16
申请号
US20100781772
申请日期
2010.05.17
申请人
FILOTEO, JR. DARIO S.;ESPIRITU EMMANUEL;CABLAO PHILIP LYNDON;STATS CHIPPAC LTD.
发明人
FILOTEO, JR. DARIO S.;ESPIRITU EMMANUEL;CABLAO PHILIP LYNDON