发明名称 RADIATION-SHIELDED SEMICONDUCTOR DEVICE
摘要 A semiconductor device is disclosed including an electromagnetic radiation shield. The device may include a substrate having a shield ring defined in a conductance pattern on a surface of the substrate. One or more semiconductor die may be affixed and electrically coupled to the substrate. The one or more semiconductor die may then be encapsulated in molding compound. Thereafter, a metal may be plated around the molding compound and onto the shield ring to form an EMI/RFI shield for the device.
申请公布号 US2013087895(A1) 申请公布日期 2013.04.11
申请号 US201113253344 申请日期 2011.10.05
申请人 UPADHYAYULA SURESH KUMAR;TAKIAR HEM;LIAO CHIH-CHIN 发明人 UPADHYAYULA SURESH KUMAR;TAKIAR HEM;LIAO CHIH-CHIN
分类号 H01L23/552;H01L21/56;H01L21/58 主分类号 H01L23/552
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