发明名称 ASSEMBLY STRUCTURE FOR ELECTRONIC DEVICE
摘要 <p>Provided is an assembly structure for an electronic device including a cover chassis, a bottom chassis and a printed circuit board, wherein the printed circuit board is arranged inside the electronic device and the cover chassis is attached to the bottom chassis. One side of the cover chassis is engaged with the bottom chassis and the cover chassis is rotationally attached to the bottom chassis with the engaged side as a pivot. Thereby, positioning is easy when assembling the chassis and the components on a printed circuit board are protected from damage.</p>
申请公布号 WO2013051074(A1) 申请公布日期 2013.04.11
申请号 WO2011JP05661 申请日期 2011.10.07
申请人 MITSUBISHI ELECTRIC CORPORATION;TAKEDA, KENGO 发明人 TAKEDA, KENGO
分类号 H05K5/03;H05K5/02 主分类号 H05K5/03
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