发明名称 METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed circuit board which is excellent in thermal stability and mechanical strength, which includes an incombustible insulating layer, and which is suitable for the imprinting lithographic method. <P>SOLUTION: The method for manufacturing a printed circuit board comprises the step of coating a substrate surface with an incombustible resin composition to form an incombustible insulating layer. The incombustible resin composition comprises: (a) a complex epoxy resin which contains 5-20 pts.wt. of bisphenol A-type epoxy resin having an epoxy equivalent of 100-700, 30-60 pts.wt. of cresol novolak type epoxy resin having an epoxy equivalent of 100-600, 5-15 pts.wt. of rubber-modified epoxy resin having an epoxy equivalent of 100-500, and 15-30 pts.wt. of phosphorus-base epoxy resin having an epoxy equivalent of 400-800; (b) an aminotriazine hardening agent; (c) a hardening accelerator; and (d) an inorganic filler. The incombustible resin composition has a lowest viscosity of 1.0-250.0 Pa sec. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013065817(A) 申请公布日期 2013.04.11
申请号 JP20120112079 申请日期 2012.05.16
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 CHO JAE-CHOON;JEON HEUI SUN;LEE CHOON-KEUN;LEE HWA-YOUNG
分类号 H05K3/18;H05K1/03 主分类号 H05K3/18
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