摘要 |
A composition suitable for the treatment of fibrous and porous materials comprises a mixture and/or reaction product of (1) an organosilicon compound having at least one organic substituent containing a reactive hydrogen atom and (2) a triazine of general formula <FORM:1088662/C3/1> wherein each A is halogen and B is either (i) a secondary or tertiary amino radical R1R2N-, where R1 and R2 are each alkyl, aryl or alkaryl radicals, or (ii) a hydrocarbonoxy group of formula R3O, where R3 is an alkyl or aryl radical. The organic substituent of the organosilicon compound may be a Si-bonded amino substituted hydrocarbon radical especially one containing methyl (g -aminopropyl) or methyl (d -aminobutyl) siloxane units and dimethyl siloxane units. B in the formula above may be the N-methylanilino radical. The composition may be used as an aqueous emulsion which may contain an emulsion stabilizer (e.g. polyvinyl alcohol) and also a cationic emulsifying agent.ALSO:Fibrous and porous materials (e.g. cotton and polyester fabrics or paper) are treated by applying thereto a mixture and/or a reaction product of (1) an organosilicon compound having at least one organic substituent containing a reactive hydrogen atom and (2) a triazine of general formula: <FORM:1088662/D1-D2/1> in which each A is halogen and B is either (i) a secondary or tertiary amino radical R1R2N-in which R1 and R2 are each alkyl, aryl or alkaryl radicals, or (ii) a hydrocarbonoxy group R3O where R3 is an alkyl or aryl radical. The organic substituent of the organosilicon compound may be a Si-bonded amino substituted hydrocarbon radical especially one containing methyl (g -aminopropyl) or methyl (d -aminobutyl) siloxane units and dimethylsiloxane units. B in the aminotriazine may be N-methylanilino radical. The composition may be used as an aqueous emulsion which may contain an emulsion stabilizer (e.g. polyvinyl alcohol) and also a cationic emulsifying agent. The porous or fibrous material may be treated with a base prior to applying the composition of the invention and it may be subjected to heating at 100-160 DEG C. following application of the composition. |