摘要 |
A semiconductor integrated circuit includes a semiconductor chip including a memory cell array, a plurality of first through-chip vias configured to vertically penetrate through the semiconductor chip and operate as an interface for a signal and a supply voltage, and a semiconductor substrate. The semiconductor substrate includes a peripheral circuit region coupled to the plurality of first through-chip vias and configured to control the semiconductor chip and a conductivity pattern region configured to operate as an interface for the signal and the supply voltage between the peripheral circuit region and an external controller. |