发明名称 SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor memory device that allows improving reading speed and to provide a method of manufacturing the same. <P>SOLUTION: The semiconductor memory device includes a stack having a plurality of electrode films and interlayer insulating films provided by alternately stacking both films, semiconductor pillars penetrating through the stack in the stacking direction, charge storage films provided between the semiconductor pillars and the electrode films, and additional portions provided on side surfaces of the semiconductor pillars. The semiconductor pillars are formed using a semiconductor material containing germanium, and the additional portions are formed using aluminum oxide. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013062325(A) 申请公布日期 2013.04.04
申请号 JP20110198806 申请日期 2011.09.12
申请人 TOSHIBA CORP 发明人 FUJIKI JUN;FUKUZUMI YOSHIAKI;AOCHI HIDEAKI
分类号 H01L21/8247;H01L21/336;H01L27/115;H01L29/788;H01L29/792 主分类号 H01L21/8247
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