发明名称 INSULATING FINE PARTICLE, INSULATING FINE PARTICLE COVERED CONDUCTIVE FINE PARTICLE, ANISOTROPIC CONDUCTIVE ADHESIVE COMPOSITION, AND ANISOTROPIC CONDUCTIVE MOLDING
摘要 <P>PROBLEM TO BE SOLVED: To provide an insulating fine particle suitable for covering conductive fine particles, having strong adhesiveness to the surface of conductive fine particles and hard in coming-off/desorption from the surface of the conductive fine particles, and in a case where the insulating fine particle covered conductive fine particles, covered with the insulating fine particle, are contained in the anisotropic conductive adhesive composition, even if the density of the insulating fine particle covered conductive fine particles is increased so that the insulating fine particle covered conductive fine particles are adjoined each other, the insulating fine particle has a sufficient elasticity, causing no plastic deformation, thereby exhibiting excellent conductivity and insulation performance. <P>SOLUTION: The insulating fine particle for covering conductive fine particles of the present invention is an insulating fine particle for covering the conductive fine particles which has a core-shell structure having a shell layer on the outer periphery of a core layer. The core layer contains vinyl polymer, and the shell layer contains amino resin. 0.10<d/D<2.0, where Dnm is the diameter of the core part and dnm is thickness of the shell part. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013062069(A) 申请公布日期 2013.04.04
申请号 JP20110198432 申请日期 2011.09.12
申请人 NIPPON SHOKUBAI CO LTD 发明人 SHIMIZU SHUJI;SASAKI YOSHIKUNI
分类号 H01B5/00;C09J9/02;C09J11/04;C09J201/00;H01B1/00;H01B1/22;H01B5/16;H01B17/60;H01R11/01 主分类号 H01B5/00
代理机构 代理人
主权项
地址