发明名称 BONDING STRUCTURE
摘要 A bonding structure includes a first connecting body, an adhesive, and a second connecting body. The first connecting body has a bonding surface subject to one or more recessed grooves. The second connecting body is bonded to the bonding surface of the first connecting body by the adhesive. The bonding surface of the first connecting body defines an adhesive receiving groove, the adhesive is received in the adhesive receiving groove and bonds with the second connecting body; the adhesive receiving groove defines an initial adhesive receiving portion recessed from a bottom surface of a portion of the adhesive receiving groove; the initial adhesive receiving portion is for receiving injected adhesive, a depth of the initial adhesive receiving portion is slightly greater than that of the adhesive receiving groove to allow flow and expansion of the glue into the adhesive receiving groove when external force to bond is applied.
申请公布号 US2013084431(A1) 申请公布日期 2013.04.04
申请号 US201213534213 申请日期 2012.06.27
申请人 ZHAO QI-JUN;SHI FA-GUANG;LUO MING-FU;HON HAI PRECISION INDUSTRY CO., LTD.;FU TAI HUA INDUSTRY (SHENZHEN) CO., LTD. 发明人 ZHAO QI-JUN;SHI FA-GUANG;LUO MING-FU
分类号 B32B3/10;B32B37/00;B32B38/10 主分类号 B32B3/10
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