发明名称 |
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME |
摘要 |
There is provided a semiconductor package including: a substrate having at least one element mounted thereon; a prepreg layer stacked on the substrate to cover the at least one element; a metal shielding layer stacked on the prepreg layer to electrically shield the at least one element; and a via electrode penetrating through the metal shielding layer and the prepreg layer and electrically connected to a ground electrode formed on the substrate. |
申请公布号 |
US2013082366(A1) |
申请公布日期 |
2013.04.04 |
申请号 |
US201113325401 |
申请日期 |
2011.12.14 |
申请人 |
JUNG KWANG CHUN;SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
JUNG KWANG CHUN |
分类号 |
H01L23/552;H01L21/78 |
主分类号 |
H01L23/552 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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